Would love to hear more about recent progresses on 3D interconnects (more products in market recently) and the effects it has on reimagining design - integration - packaging co-optimisation. This actually requires to go for System first approach, model down to every interconnects for power, performance (latency limiter) and reliability.
Would love to hear more about recent progresses on 3D interconnects (more products in market recently) and the effects it has on reimagining design - integration - packaging co-optimisation. This actually requires to go for System first approach, model down to every interconnects for power, performance (latency limiter) and reliability.
I have some notes from that part of the conference. I need to really sit down and write about it.
Good event
Thank you for distilling the talks for people who couldn't make it! Looking forward to that future post.